The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift throughout the electronics industry: more cooperation Ａnd information sharing, the association says. Published biennially in CD format, the nearly 600-page guide to interconnect technology trends was developed with input from subject matter experts globally. The 2013 roadmap incorporates data Ａnd comparisons to help users serve clients Ａnd/or guide their companies in identifying, selecting Ａnd developing technology alternatives to create the products needed for future markets. One of the changes is an expＡnded section on printed electronics, focusing on more realistic opportunities Ａnd challenges of the technology. Another change within the 2013 roadmap can be found in the environmental section, renamed the “stewardship” section. In addition, the roadmap includes technical presentations made by industry experts within a resource section that provides predictions Ａnd descriptions. The roadmap has an updated section addressing the changes in business models Ａnd expectations between OEMs, ODMs, EMS providers Ａnd fabricators, Ａnd the rise of contractor specialists for previously internal functions.