Construction：6 Layer 1-level HDI with buried vias 1+(4)+1Base Material：Tg150℃ FR4Surface Finish：ENIG
Higher Layer productApplication：Telecommunication
1、Metal PCB2、High thermal conductivity required3、V-CUT required，the left thickness is 0.5mm4、Top soldermask color：matt-Green；bottom soldermask color：matt-Black
1、HDI structure：2+N+2 with stacked vias2、Laser micro vias(0.1mm big)：L1-L2、L3-L4、L16-L15、L15-L143、Buried hole between L2 and L15.Buried holes are filled with resin and plated over by copper.4、Specific impedance control with 50+/-5 Ohms and differential impedance control with 85+/-8.5 Ohms
1、Aspect Ratio：18:12、Blind vias form L32-L343、Via-in-Pad(VIPPO),Countersink holes4、Over 20 Impedance controlled lines