Construction：6 Layer 1-level HDI with buried vias 1+(4)+1Base Material：Tg150℃ FR4Surface Finish：ENIG
Specifications Items Characteristics Operating Temperature Range -40ºC~+105ºC Rated Voltage Range 200~450Vdc Capacitance Tolerance ±20%(M) (25ºC, 120Hz) Leakage Current 200~450Vdc Where,I:max.leakage current(μA),C:Nominal capacitance(μ F),V:Rated voltage(V) (At 25ºC after 5 minutes) I≤0.03 CV Dissipation Factor (tanδ) Rated voltage(VdC) 200 250 350...
Higher Layer productApplication：Telecommunication
1、Metal PCB2、High thermal conductivity required3、V-CUT required，the left thickness is 0.5mm4、Top soldermask color：matt-Green；bottom soldermask color：matt-Black
1、HDI structure：2+N+2 with stacked vias2、Laser micro vias(0.1mm big)：L1-L2、L3-L4、L16-L15、L15-L143、Buried hole between L2 and L15.Buried holes are filled with resin and plated over by copper.4、Specific impedance control with 50+/-5 Ohms and differential impedance control with 85+/-8.5 Ohms